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1.
Microelectronics packaging handbook: Subsystem packaging. Part.3.

by Tummala, R. R. Editor.

Edition: 2nd. Edition. Material type: book Book; Format: print ; Literary form: not fiction Publisher: New York Chapman and Hall 1996Availability: Items available for reference: [Call number: 621.3810 TUM] (1).

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2.
Microelectronics packaging handbook: Semiconductor packaging. Part.2.

by Tummala, R. R. Editor.

Edition: 2nd. Edition. Material type: book Book; Format: print ; Literary form: not fiction Publisher: New York Chapman and Hall 1996Availability: Items available for reference: [Call number: 621.3810 TUM] (1).

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3.
Microelectronics packaging handbook: Technology drivers. Part. 1.

by Tummala, R. R. Editor.

Edition: 2nd. Edition. Material type: book Book; Format: print ; Literary form: not fiction Publisher: New York Chapman and Hall 1996Availability: Items available for reference: [Call number: 621.3810 TUM] (1).

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